IN-MOLD ELECTRONICS
FEATURES
- 3D forms that allow futuristic designs.
- Embedded solution that protect against extreme exposure and environmental conditions, providing higher reliability.
- Electronic solution that does not wear out.
- Less weight and less «real state» use.
- Soft touch controls, that can be calibrated for sensor activation.
- Haptic Feedback.
- Applicable for HMI, wearable solutions and embedded sensors.
IN-HOUSE CAPABILITIES
- Complete vertical integration allows to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector.
- Plastic injection molded of structural electronics.
- Graphic Fascia design and manufacturing.
- Capacitive sensor design and manufacturing.
- Mold design and construction.
- SMT components placement.
- Software design and programming.
BENEFITS
Our complete vertical integration allows us to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector, this creates:
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Reduction of time from start to production parts.
- Lower investment requirements.
- Lower risk.
- Reduction on engineering hours required by client.
- Single source for full integration cost savings.