IN-MOLD ELECTRONICS

 

FEATURES

  • 3D forms that allow futuristic designs.
  • Embedded solution that protect against extreme exposure and environmental conditions, providing higher reliability.
  • Electronic solution that does not wear out.
  • Less weight and less «real state» use.
  • Soft touch controls, that can be calibrated for sensor activation.
  • Haptic Feedback.
  • Applicable for HMI, wearable solutions and embedded sensors.

IN-HOUSE CAPABILITIES

  • Complete vertical integration allows to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector.
  • Plastic injection molded of structural electronics.
  • Graphic Fascia design and manufacturing.
  • Capacitive sensor design and manufacturing.
  • Mold design and construction.
  • SMT components placement.
  • Software design and programming.

BENEFITS

Our complete vertical integration allows us to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector, this creates:

  • Reduction of time from start to production parts.

  • Lower investment requirements.
  • Lower risk.
  • Reduction on engineering hours required by client.
  • Single source for full integration cost savings.
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