IN-MOLD ELECTRONICS

FEATURES

• 3D forms that allow futuristic designs.
• Embedded solution that protect against extreme exposure and environmental conditions, providing higher reliability.
• Electronic solution that does not wear out.
• Less weight and less «real state» use.
• Soft touch controls, that can be calibrated for sensor activation.
• Haptic Feedback.
• Applicable for HMI, wearable solutions and embedded sensors.

IN-HOUSE CAPABILITIES

• Complete vertical integration allows to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector.
• Plastic injection molded of structural electronics.
• Graphic Fascia design and manufacturing.
• Capacitive sensor design and manufacturing.
• Mold design and construction.
• SMT components placement.
• Software design and programming.

BENEFITS

Our complete vertical integration allows us to make fast iterations between mold construction, injection, Graphic Fascia, Capacitive sensor, and connector, this creates:

• Reduction of time from start to production parts.

• Lower investment requirements.
• Lower risk.
• Reduction on engineering hours required by client.
• Single source for full integration cost savings.